摘要 |
PROBLEM TO BE SOLVED: To provide a probe of socket for integrated circuits capable of restraining contact resistance value and acquiring stabilized characteristics. SOLUTION: When bumps of IC package are abutted against, a first terminal of the probe of socket for integrated circuits, where a plurality of chevron-shaped herring bone gears a to d, formed at the head point of a first terminal 12 so as to differ each height of the chevron-shaped herring-bone gears concerned, tilts to a cylindrical body 11 so as to contact internal perimeter of the aforementioned cylindrical body. COPYRIGHT: (C)2007,JPO&INPIT
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