发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent damage to a light-receiving surface and deterioration of light-receiving characteristics, and has high light reception sensitivity. <P>SOLUTION: In the semiconductor device 1, an optical semiconductor element 10, a circular metal plate 20, a metal plate 30 and bumps 41, 42 are sealed with a resin 50. The bottom surfaces of the circular metal plate 20 and the metal plate 30 are provided on a common virtual plane. The top surface of the optical semiconductor element 10 is covered with the resin 50 provided on one side for the virtual plane. A light-receiving portion 13 of the optical semiconductor element 10, and the bottom surfaces of the circular metal plate 20 and the metal plate 30 are not covered with the resin 50, but exposed. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008047830(A) 申请公布日期 2008.02.28
申请号 JP20060224530 申请日期 2006.08.21
申请人 HAMAMATSU PHOTONICS KK 发明人 SAKAKIBARA MASAYUKI;INOUE HITOSHI;SUGIURA HISAYA
分类号 H01L31/02;H01L23/02;H01L23/08;H01L23/12 主分类号 H01L31/02
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