| 摘要 |
A substrate repairing method is provided to improve a yield and reduce a production cost by efficiently repairing damage such as minute crack, scratch and breakage generated on a substrate. A damaged portion of a substrate is detected(S110). Bonding material for partially filling the damaged portion of the substrate is provided(S120). The bonding material is formed in the damaged portion of the substrate(S130). By hardening the bonding material, the damaged portion of the substrate is repaired(S140). The bonding material is provided in a paste form by melting glass minute powers. The melting process is performed by performing a heating process at 400 degrees Celsius. |
