发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a rectangular laser spot of a predetermined size and a high laser power density on a target object surface. SOLUTION: This semiconductor manufacturing apparatus includes a control unit for controlling the laser power of a laser source for emitting laser beams, an optical waveguide unit 1 consisting of a core portion 16 for transmitting the laser beams and a clad portion 17 covering the core portion 16, and a lens 2 for forming the laser beams emitted from the emitting end face 15 of the optical waveguide unit 1 to the laser spot of a predetermined shape. The emitting end face 15 of the optical waveguide unit 1 has a rectangular core 16 where one side 1μm to 20μm in length and the other side orthogonal to the one side is 1 mm to 60 mm in length, and the laser power of the laser source is set to a value to make the power density of the laser spot emitted from the core 16 be 0.1 mW/μm<SP>2</SP>or more. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009049030(A) 申请公布日期 2009.03.05
申请号 JP20070210733 申请日期 2007.08.13
申请人 HITACHI COMPUTER PERIPHERALS CO LTD 发明人 OGINO YOSHIAKI;KIMURA KATSUMI;IIDA YASUHIRO;SOGA KAZUHIRO
分类号 H01L21/268;H01L21/20 主分类号 H01L21/268
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