| 摘要 |
PROBLEM TO BE SOLVED: To prevent corrosion of a substrate electrode of a wiring board where a semiconductor chip is mounted. SOLUTION: A semiconductor device comprises: a resin projection 18 arranged on a passivation film 16; and a plurality of wires 20 that are extended so that they reach an area on the resin projection 18 from an area on a plurality of pads 14 and are arranged with a gap mutually on the resin projection 18. An electronic device comprises: a semiconductor device; a wiring board 24 where a wiring pattern 26 including a plurality of substrate electrodes 30 is formed and the semiconductor device is mounted so that the plurality of wires 20 face the plurality of substrate electrodes 30; and an adhesive 32 for bonding the semiconductor device to the wiring board 24. The plurality of wires 20 are formed by a material which hardly corrodes as compared with the plurality of substrate electrodes 30. Each wire 20 continuously covers a region reaching the outside over the edge in a direction of an adjacent substrate electrode 30 from the center of either substrate electrode 30. COPYRIGHT: (C)2009,JPO&INPIT
|
