| 发明名称 |
HEAT SHIELD FILM AND METHOD OF FORMING HEAT SHIELD FILM |
| 摘要 |
A heat shield film (100) that is formed on a wall surface of an aluminum-based member (W) includes: a matrix layer (10) diffusion-bonded to the wall surface (diffusion bonding layer (10′)), having a coefficient of linear expansion of 15×10−6/K to 25×10−6/K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and hollow particles (20) dispersed in the matrix layer (10). |
| 申请公布号 |
US2016201555(A1) |
申请公布日期 |
2016.07.14 |
| 申请号 |
US201414912261 |
申请日期 |
2014.08.18 |
| 申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
EDA Akinori |
| 分类号 |
F02B77/11;B22D21/00;C23D5/02;B22D19/08 |
主分类号 |
F02B77/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat shield film comprising:
a matrix layer having a coefficient of linear expansion of 15×10−6/K to 25×10−6/K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and hollow particles dispersed in the matrix layer, wherein the heat shield film is formed on a wall surface of an aluminum-based member, and the heat shield film is diffusion-bonded to the wall surface. |
| 地址 |
Toyota-shi, Aichi-ken JP |
