TESTING DEVICE AND ASSEMBLING METHOD THEREOF

摘要

A testing device utilized in a testing apparatus includes a top guiding board having top penetrating openings, a bottom guiding board disposed at one side of the top guiding board and having bottom penetrating openings, and elastic contact structures disposed between the top guiding board and the bottom guiding board. A testing device offset (represented by d2) exists between the top guiding board and the bottom guiding board. Each elastic contact structure has a tip section, a body section, and a tail section in sequence. The elastic contact structures pass through the top penetrating openings and the bottom penetrating openings respectively Each elastic contact structure has an elastic contact structure offset between the tip section and the tail section. Each elastic contact structure has a target elastic contact structure offset (represented by d1), in which d1 and d2 satisfy the following equation:;d2=d1±50˜200 μm.

主权项

1. A testing device utilized in a testing apparatus, the testing device comprising:
a top guiding board having a plurality of top penetrating openings; a bottom guiding board disposed at one side of the top guiding board and having a plurality of bottom penetrating openings, wherein there is a testing device offset between the top guiding board and the bottom guiding board; and a plurality of elastic contact structures disposed between the top guiding board and the bottom guiding board, each of the elastic contact structures having a tip section, a body section, and a tail section m sequence, wherein elastic contact structures pass through the top penetrating openings and the bottom penetrating openings respectively, and each of the elastic contact structures has an elastic contact structure offset defined between the tip section and the tail section, and each of the elastic contact structures has a target elastic contact structure offset, wherein the target elastic contact structure offset and the testing device offset satisfy the following equation: d2=d1±50˜200 μm, wherein d1 represents the target elastic contact structure offset, and d2 represents the testing device offset.