发明名称 |
MICRO-LIGHT-EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A micro-light-emitting diode (micro-LED) device includes a first semiconductor layer, an active layer, and a second semiconductor layer. The first semiconductor layer includes a first bottom surface. The active layer is disposed on the first semiconductor layer. The second semiconductor layer disposed on the active layer includes a second bottom surface. A surface of the second semiconductor layer opposite to the active layer is a light-exiting surface of the micro-LED device. The second semiconductor layer has different thicknesses, in which a minimum thickness of the second semiconductor layer is located at an edge or at least one side of the second semiconductor layer. Vertical-projection zones of the first semiconductor layer, the active layer, and the second semiconductor layer on the first bottom surface are substantially the same. |
申请公布号 |
US2016336486(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201615060885 |
申请日期 |
2016.03.04 |
申请人 |
AU Optronics Corporation |
发明人 |
LIN Tsung-Yi;Chang Cheng-Chieh |
分类号 |
H01L33/24;H01L33/58;H01L33/00;H01L33/36 |
主分类号 |
H01L33/24 |
代理机构 |
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代理人 |
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主权项 |
1. A micro-light-emitting diode device comprising:
a first semiconductor layer having a first bottom surface; an active layer disposed on the first semiconductor layer; and a second semiconductor layer having a second bottom surface, the second semiconductor layer being disposed on the active layer, a surface of the second semiconductor layer opposite to the active layer being a light-exiting surface of the micro-light-emitting diode device, the second semiconductor layer having multiple thicknesses, a minimum thickness of the second semiconductor layer being located at an edge or at least one side of the second semiconductor layer, vertical-projection zones of the first semiconductor layer, the active layer, and the second semiconductor layer on the first bottom surface being substantially the same. |
地址 |
Hsin-Chu TW |