发明名称 |
SUBMOUNTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES AND SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES INCLUDING THE SAME |
摘要 |
A submount (14) for a solid state lighting package (50) includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad. |
申请公布号 |
EP2011163(A2) |
申请公布日期 |
2009.01.07 |
申请号 |
EP20070753914 |
申请日期 |
2007.03.22 |
申请人 |
CREE INC. |
发明人 |
LOH, BAN, P.;MEDENDORP, NICHOLAS, W., JR.;KELLER, BERND |
分类号 |
H01L25/075;H01L33/62 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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