SUBSTRATE PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing device satisfactorily providing a processing using a high-temperature processing solvent to a substrate. SOLUTION: A first cooling pipe 38 for cooling an SPM liquid attached to an outside wall surface 37 of the substrate processing device is arranged on an attachment position of the SPM liquid on the outside wall surface 37 of a guiding part 24 of an inside constructional member 20. A first cooling pipe 38 is formed in helical shape centering around a rotational axis line C. A second cooling pipe 48 for cooling the SPM liquid attached to the inside wall surface 47 is arranged in the attachment position of the SPM liquid of the inside wall surface 47 of the outside constructional member 30. The second cooling pipe 48 is formed in helical shape centering around the rotational axis line C. the deformation of the inside constructional member 20 and the outside constructional member 30 are, therefore, respectively prevented. COPYRIGHT: (C)2009,JPO&INPIT