NONMETAL BONDED METAL SUBSTRATE

摘要

The present invention relates to a structure of a substrate where a module is mounted. The substrate comprises: a plurality of metal frames insulated and bonded to mount a module and apply electricity to an electrode of the module; an insulation layer orthogonally formed among the bonded metal frames to insulate the metal frames; and a nonmetal frame mutually bonded on one side of a plurality of unit substrates formed by the metal frames to limit at least a part of transfer of action, which is applied to the metal frame by the module mounted on the unit substrate, to other unit substrates. According to the present invention, since metal and nonmetal are horizontally bonded, heat generated from one metal frame is prevented from being transferred to other metal frames. Moreover, when metal and nonmetal are horizontally bonded, a bonding order thereof can be diversely selected, so heat transfer properties can be selectively kept or limited.