发明名称 固体撮像装置及びその製造方法
摘要 A solid-state imaging device includes: a substrate; an insulator layer formed on the substrate; a semiconductor layer formed on the insulator layer; and a silicon layer formed on the semiconductor layer. The silicon layer includes a plurality of pixels each including a photoelectric converter configured to convert light into signal charge, and a circuit configured to read the signal charge, and a refractive index of the insulator layer is lower than a refractive index of the semiconductor layer.
申请公布号 JP6020933(B2) 申请公布日期 2016.11.02
申请号 JP20130517822 申请日期 2012.04.12
申请人 パナソニックIPマネジメント株式会社 发明人 沖野 徹;森 三佳;廣瀬 裕;加藤 剛久;田中 毅
分类号 H01L27/146;H01L27/14;H04N5/374 主分类号 H01L27/146
代理机构 代理人
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