发明名称 RESISTOR AND METHOD FOR MANUFACTURING RESISTOR
摘要 In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.
申请公布号 US2016336099(A1) 申请公布日期 2016.11.17
申请号 US201515110096 申请日期 2015.01.07
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 Nagase Toshiyuki;Ishizuka Hiroya
分类号 H01C1/084;H01C17/00;H01C17/28;H01C1/14 主分类号 H01C1/084
代理机构 代理人
主权项 1. A resistor comprising: a chip resistive element formed on one surface of a ceramic substrate, wherein the chip resistive element includes a resistive element and a metal electrode; a metal terminal electrically connected to the metal electrode; and an Al member formed on the other surface of the ceramic substrate, wherein the ceramic substrate and the Al member are joined together using an Al—Si-based brazing filler material, and the metal electrode and the metal terminal are respectively joined to a first end and a second end of a metal member having a melting point of 450° C. or higher, thereby being electrically connected to each other.
地址 Tokyo JP