发明名称 |
RESISTOR AND METHOD FOR MANUFACTURING RESISTOR |
摘要 |
In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time. |
申请公布号 |
US2016336099(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201515110096 |
申请日期 |
2015.01.07 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Nagase Toshiyuki;Ishizuka Hiroya |
分类号 |
H01C1/084;H01C17/00;H01C17/28;H01C1/14 |
主分类号 |
H01C1/084 |
代理机构 |
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代理人 |
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主权项 |
1. A resistor comprising:
a chip resistive element formed on one surface of a ceramic substrate, wherein the chip resistive element includes a resistive element and a metal electrode; a metal terminal electrically connected to the metal electrode; and an Al member formed on the other surface of the ceramic substrate, wherein the ceramic substrate and the Al member are joined together using an Al—Si-based brazing filler material, and the metal electrode and the metal terminal are respectively joined to a first end and a second end of a metal member having a melting point of 450° C. or higher, thereby being electrically connected to each other. |
地址 |
Tokyo JP |