| 摘要 |
PURPOSE: A dispensing head unit for a semiconductor package is provided to prevent a tail from being generated, by having a servo motor and a bearing for emitting epoxy resin by a forward revolution of the motor and for absorbing the epoxy resin remaining on a needle by a reverse revolution. CONSTITUTION: A dispensing head unit for a semiconductor package comprises a resin receptacle(300), an induction unit, a resin quantity controlling unit(400), and a dispensing head. The resin receptacle has epoxy resin. The induction unit inducts the resin, connected to a side of the resin receptacle. The resin quantity controlling unit condenses and/or extends an induction tube connected to the induction unit to control the quantity of the resin. The dispensing head includes an exhaust unit(430) for applying exhausted from the resin quantity controlling unit on a semiconductor chip.
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