3DIC STACKING DEVICE AND METHOD OF MANUFACTURE

摘要

Provided are a system and a method for stacking semiconductor devices with 3D. According to the present invention, at least two semiconductor dies are bonded to a carrier and capsulated. The connection parts of the at least two semiconductor dies are exposed. The connection parts are formed on an opposite side by thinning the at least two semiconductor dies. After that, additional semiconductor dies can be arranged in an offset or overhang position.