SAMPLE SUPPORT BUILT BY SEMICONDUCTOR SILICON PROCESS TECHNIQUE

摘要

PROBLEM TO BE SOLVED: To provide a sample support for fixing a specimen acquired by pin point sampling, without requiring skilled techniques and without the problems of surface flatness, such as mesh or back ground noise. SOLUTION: The sample support is produced from a silicon substrate as the material, the shape and the thickness construction of≤10μm is formed by the semiconductor silicon process technology, and the sample support is stuck on the half-cut mesh so as to avoid the specimen part, and a plurality of fixing parts of the sample are arranged on the same substrate. COPYRIGHT: (C)2006,JPO&NCIPI