发明名称 MOLDING RESIN HAVING ELECTRICAL INSULATING PROPERTY AND EXCELLENT THERMAL CONDUCTIVITY
摘要 PROBLEM TO BE SOLVED: To obtain a molding resin which is a heat-conductive resin having electrical insulating properties made by greatly improving thermal conductivity of a polyamide resin and is useful for various kinds of electric/electronic parts, automobile electric parts, etc., requiring heat dissipation and electrical insulating properties. SOLUTION: The molding resin is a heat-conductive resin obtained by mixing a polyamide resin (hereinafter abbreviated as nanocomposite polyamide resin) as a matrix resin, in which a laminar silicate is uniformly dispersed in a molecular level, with alumina in a high ratio and has electrical insulating properties. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006342192(A) 申请公布日期 2006.12.21
申请号 JP20050166468 申请日期 2005.06.07
申请人 DAISEE KOGYO KK 发明人 ARAI NORITAKE;YOSHIZAKI MASASHI
分类号 C08L77/00;C08K3/00;C08L81/02 主分类号 C08L77/00
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