| 摘要 |
PROBLEM TO BE SOLVED: To provide a rolling-fit apparatus and a rolling-fit method for realizing rolling fit of a rolling-fit object by setting a gap between the end edges thereof to the predetermined size on the occasion of rolling fit of the rolling-fit object such as a semiconductor chip. SOLUTION: The rolling-fit apparatus 10 utilizes a first supporting material 11 for supporting a chip C which has been individualized by dicing a semiconductor wafer, and a second supporting material 12 including the rolling-fit sheet to which the chip C is mounted to the rolling fit. The relevant rolling-fit apparatus 10 is constituted with an expanding device 44 for expanding a dicing tape DT in the radiating direction, a camera 37 for detecting a gap between the chips C formed by such expansion, and a rolling-fit unit 17 for fitting each chip C by the rolling fit to the rolling-fit sheet under the condition that the gap has reached the preset size. COPYRIGHT: (C)2007,JPO&INPIT |
