发明名称 SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND ITS WIRING DEVICE
摘要 PROBLEM TO BE SOLVED: To eliminate a trouble caused by wiring congestion when wiring is multilayered. SOLUTION: A semiconductor device includes the wiring having different sheet resistance values in the same wiring layer, so that the wiring congestion is suppressed. A method for manufacturing the semiconductor device is provided which includes the wiring composed of base materials different in sheet resistance values in the same wiring layer. A wiring device is provided which replaces a part of the wiring route of the semiconductor device into the wiring with the different sheet resistance while keeping the same wiring route. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007103620(A) 申请公布日期 2007.04.19
申请号 JP20050290709 申请日期 2005.10.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KISHISHITA KEISUKE
分类号 H01L21/822;H01L21/3205;H01L21/82;H01L23/52;H01L27/04 主分类号 H01L21/822
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