发明名称 |
SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND ITS WIRING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To eliminate a trouble caused by wiring congestion when wiring is multilayered. SOLUTION: A semiconductor device includes the wiring having different sheet resistance values in the same wiring layer, so that the wiring congestion is suppressed. A method for manufacturing the semiconductor device is provided which includes the wiring composed of base materials different in sheet resistance values in the same wiring layer. A wiring device is provided which replaces a part of the wiring route of the semiconductor device into the wiring with the different sheet resistance while keeping the same wiring route. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007103620(A) |
申请公布日期 |
2007.04.19 |
申请号 |
JP20050290709 |
申请日期 |
2005.10.04 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KISHISHITA KEISUKE |
分类号 |
H01L21/822;H01L21/3205;H01L21/82;H01L23/52;H01L27/04 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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