| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To partially increase a permissible current quantity by arranging a bus bar at a circuit, and to improve heat dissipation performance. <P>SOLUTION: A large current circuit firmly fixed with the bus bar which is composed of a conductive metal plate via a solder layer having a prescribed width not thicker than the width of a copper foil pattern is arranged at least at one part of the surface of the copper foil pattern of a printed board, and a terminal protrusively formed by bending is integrally arranged at a part of the bus bar. In another way, a terminal material which is different from the bus bar is arranged, the base of the terminal material is made to penetrate a penetration hole communicatively formed at the bus bar, the solder layer and the printed board which constitute the large current circuit, and the base of the terminal material protruded from the penetration hole of the printed board is soldered to a land. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
