Heat-Dissipating EMI/RFI Shield

摘要

A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112) which defines an open area (113). At least one mounting leg (114) extends from the sidewall and is affixed to a printed circuit board (200). The shield cap has a collar (136) which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss (156) extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component (210) on the printed circuit board.

主权项

1. A heat-dissipating EMI/RFI shield, wherein the heat-dissipating EMI/RFI shield is to be attached to a circuit board having engaging structures and a heat-generating component, the heat-dissipating EMI/RFI shield comprising:
a shield base having a plurality of sidewalls which define an open area, each sidewall having at least one engaging structure, and a plurality of legs extending from the sidewalls; a shield cap having a collar and a plurality of flanges, the collar defining an opening in the shield cap and having a plurality of fingers or springs extending therefrom, each flange having at least one leaf extending therefrom, the leaves being configured to mate with engaging structures of the shield base to secure the shield cap to the shield base; a heat sink having a boss extending therefrom, a plurality of heat-dissipating fins extending therefrom, and a plurality of platforms, each platform extending from a side of the heat sink, the boss being configured to protrude at least partially into the opening in the shield cap and to make thermal contact with the heat-generating component, the heat sink being configured to be mated to the shield cap, each platform having at least one aperture therein; and a plurality of engaging components configured to be inserted into the apertures of the platform and into the apertures in the circuit board to attach the heat-dissipating EMI/RFI shield to the circuit board; wherein the plurality of fingers of the collar of the shield cap contact the boss of the heat sink when the heat sink is mated with the shield cap.