PACKAGED INTEGRATED CIRCUIT INCLUDING A SWITCH-MODE REGULATOR AND METHOD OF FORMING THE SAME

摘要

A packaged integrated circuit and method of forming the same. The package integrated circuit includes an integrated circuit formed on a semiconductor die affixed to a surface of a multi-layer substrate, and a switch-mode regulator formed on the semiconductor die (or another semiconductor die) affixed to the surface of the multi-layer substrate. The integrated circuit and the switch-mode regulator are integrated within a package to form the packaged integrated circuit.

主权项

1. A packaged integrated circuit, comprising:
a multi-layer substrate; an integrated circuit formed on a first semiconductor die affixed to a surface of said multi-layer substrate; and a switch-mode regulator formed on a second semiconductor die affixed to said surface of said multi-layer substrate.