发明名称 THIN FILM TRANSISTOR SUBSTRATE, MANUFACTURE METHOD THEREOF AND LIQUID CRYSTAL DISPLAY
摘要 The present invention provides a manufacture method of a thin film transistor substrate: forming a first metal layer, a first chemical vapor deposition layer, a second metal layer and a second chemical vapor deposition layer on a substrate; forming photoresistor on the second chemical vapor deposition layer; implementing exposure and development to the photoresistor; implementing via etching to a via area where the photoresistor on the second chemical vapor deposition layer is removed; implementing photoresistor ashing to remove the photoresistor in the area of the common capacitor; etching the silicon nitride layer; forming a pixel electrode layer. The present invention is capable of promoting video quality and saving the backlight power consumption.
申请公布号 US2016274392(A1) 申请公布日期 2016.09.22
申请号 US201414382718 申请日期 2014.05.15
申请人 SHENZHEN CHINA STAR OPTOELETRONICS TECHNOLOGY CO., LTD. 发明人 LI JINLEI
分类号 G02F1/1368;G02F1/1362;H01L21/3213;H01L21/311;H01L21/02;H01L27/12;H01L21/027 主分类号 G02F1/1368
代理机构 代理人
主权项 1. A manufacture method of a thin film transistor substrate, the manufacture method of the thin film transistor substrate comprising steps of: providing a substrate to sequentially form a first metal layer, a first chemical vapor deposition layer, a second metal layer and a second chemical vapor deposition layer on a surface of the substrate; wherein the first metal layer comprises a lower electrode of a common capacitor, and the first chemical vapor deposition layer and the second chemical vapor deposition layer respectively comprises a silicon nitride layer; forming photoresistor on the second chemical vapor deposition layer; implementing exposure and development to the photoresistor with a halftone mask, and a position corresponding to the halftone mask is an area of the common capacitor; implementing via etching to a via area where the photoresistor on the second chemical vapor deposition layer is removed; implementing photoresistor ashing to remove the photoresistor in the area of the common capacitor; etching the silicon nitride layer in the area of the common capacitor; stripping rest of the photoresistor; forming a pixel electrode layer, wherein the pixel electrode layer comprises an upper electrode of the common capacitor.
地址 Shenzhen, Guangdong CN