发明名称 |
THIN FILM TRANSISTOR SUBSTRATE, MANUFACTURE METHOD THEREOF AND LIQUID CRYSTAL DISPLAY |
摘要 |
The present invention provides a manufacture method of a thin film transistor substrate: forming a first metal layer, a first chemical vapor deposition layer, a second metal layer and a second chemical vapor deposition layer on a substrate; forming photoresistor on the second chemical vapor deposition layer; implementing exposure and development to the photoresistor; implementing via etching to a via area where the photoresistor on the second chemical vapor deposition layer is removed; implementing photoresistor ashing to remove the photoresistor in the area of the common capacitor; etching the silicon nitride layer; forming a pixel electrode layer. The present invention is capable of promoting video quality and saving the backlight power consumption. |
申请公布号 |
US2016274392(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201414382718 |
申请日期 |
2014.05.15 |
申请人 |
SHENZHEN CHINA STAR OPTOELETRONICS TECHNOLOGY CO., LTD. |
发明人 |
LI JINLEI |
分类号 |
G02F1/1368;G02F1/1362;H01L21/3213;H01L21/311;H01L21/02;H01L27/12;H01L21/027 |
主分类号 |
G02F1/1368 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacture method of a thin film transistor substrate, the manufacture method of the thin film transistor substrate comprising steps of:
providing a substrate to sequentially form a first metal layer, a first chemical vapor deposition layer, a second metal layer and a second chemical vapor deposition layer on a surface of the substrate; wherein the first metal layer comprises a lower electrode of a common capacitor, and the first chemical vapor deposition layer and the second chemical vapor deposition layer respectively comprises a silicon nitride layer; forming photoresistor on the second chemical vapor deposition layer; implementing exposure and development to the photoresistor with a halftone mask, and a position corresponding to the halftone mask is an area of the common capacitor; implementing via etching to a via area where the photoresistor on the second chemical vapor deposition layer is removed; implementing photoresistor ashing to remove the photoresistor in the area of the common capacitor; etching the silicon nitride layer in the area of the common capacitor; stripping rest of the photoresistor; forming a pixel electrode layer, wherein the pixel electrode layer comprises an upper electrode of the common capacitor. |
地址 |
Shenzhen, Guangdong CN |