| 摘要 |
To provide a curable composition from which a cured film having a low dielectric constant and a low water-absorption and being capable of laser processing, is obtained, a laser processing method of the cured film, and a process for producing a multilayer wiring structure. A curable composition comprising a fluorinated polyarylene prepolymer (A) having a crosslinkable functional group, a laser processing method comprising irradiating a cured film obtained by curing the composition with laser light to remove a part of the cured film, and a process for producing a multilayer wiring structure, comprising a step of forming a via hole in an insulation film made of the cured film by the processing method. |
