| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED manufacturing method capable of manufacturing the LED with a high yield by preventing damage to an LED wafer, and further preventing a metal layer from being formed outside a light-emitting element in a reflective layer formation step.SOLUTION: An LED manufacturing method including a back-grinding step of polishing a substrate of an LED wafer comprising the substrate and a light-emitting element on one surface of the substrate and a reflective layer formation step of forming a reflective layer outside the substrate includes sticking a heat-resistant adhesive sheet to the outside of the light-emitting element of the LED wafer. |
