发明名称 METHOD FOR MOLDING THERMOSETTING RESIN MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a method for easily and highly accurately molding a large- sized thin molded product difficult to mold heretofore in a method for molding a molded product using a thermosetting resin molding compound containing 70-90 wt.% of graphite and low in flowability at the time of molding. SOLUTION: In a method for molding the molded product with a plane size of 200 cm<2> or more and a thickness of 2.5 mm or less from the thermosetting resin molding compound containing 70-90 wt.% of graphite with respect to the whole of the molding compound, (1) a volatile component contained in the molding compound is adjusted to 2-15 wt.% and (2) a preformed object having a plane size being 40-100% of that of the molded product is molded and (3) the volatile component contained in the preformed object is adjusted to 2 wt.% or less and (4) this preformed object is molded in a mold under heating and pressure.
申请公布号 JP2002273749(A) 申请公布日期 2002.09.25
申请号 JP20010077541 申请日期 2001.03.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 SUZUKI TAKAYUKI
分类号 B29C43/02;B29C43/32;C08K3/04;C08L101/00;H01M8/02 主分类号 B29C43/02
代理机构 代理人
主权项
地址