PACKAGE FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT USING SUCH PACKAGE, AND METHOD FOR PRODUCING PACKAGE FOR ELECTRONIC COMPONENT

摘要

[Object] To provide an electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. [Solving Means] A package 1 includes a shield case 10 formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole 13; a resin case 2 molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal 20 that is insert-molded in the resin case such that the hot terminal is inserted into the shield case 10 through the through hole 13 without contact, one end of the hot terminal is exposed at an inner surface of the resin case 2, and the other end of the hot terminal is exposed at an outer surface of the resin case 2. An element S contained in the package 1 is surrounded by the shield case 10 so that good shielding performance is obtained.