| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate and its manufacturing method capable of forming an electrode adapted to a bump on a substrate even if a bump pitch of electronic components such as flip chip becomes narrower by improving flexibility in wiring design on the substrate. SOLUTION: A wiring substrate 20 comprises an insulating layer 11, two pieces of wiring 10a and 10b formed on both front and rear surfaces of the insulating layer 11 in a thickness direction, respectively, and a plurality of electrodes 3 that are provided to points on the surface of the insulating layer 11 of an electronic component mounting region A formed on one surface of the insulating layer 11 for electrically bonding electronic components. The electrode 3 has a bonding surface 3a bonded to an electronic component. The bonding surface 3a is exposed from the surface of the insulating layer 11. A portion of the electrode 3 except for the bonding surface 3a is embedded in the insulating layer 11. COPYRIGHT: (C)2008,JPO&INPIT |
