Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

摘要

The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, and the filler contains boron nitride particles having particle sizes of from 10 μm to 100 μm. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.;

主权项

1. A resin composition comprising
an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, and the filler having particle sizes of from 10 μm to 100 μm contains boron nitride particles; wherein in the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group; each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group; m represents a number from 0 to 2; and n represents a number from 1 to 7.