发明名称 |
CMOS image sensor with epitaxial passivation layer |
摘要 |
The present disclosure provides a complimentary metal-oxide-semiconductor (CMOS) image sensor (CIS) device. In accordance with some embodiments, the device includes a semiconductor region having a front surface and a back surface; a light-sensing region extending from the front surface towards the back surface within the semiconductor region; a gate stack formed over the semiconductor region; and at least one epitaxial passivation layer disposed at least one of over and below the light-sensing region. In some embodiments, the at least one epitaxial passivation layer includes a p-type doped silicon (Si) layer. |
申请公布号 |
US9349768(B2) |
申请公布日期 |
2016.05.24 |
申请号 |
US201414229348 |
申请日期 |
2014.03.28 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Cheng Yu-Hung;Tseng Tung-Hsiung;Wu Cheng-Ta;Tu Yeur-Luen;Tsai Chia-Shiung;Lee Ru-Liang;Ting Shyh-Fann;Sze Jhy-Jyi;Lin Tung-I;Chen Wei-Li |
分类号 |
H01L27/14;H01L27/146;H01L31/0288;H01L31/0336;H01L31/0216;H01L31/18 |
主分类号 |
H01L27/14 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A complimentary metal-oxide-semiconductor (CMOS) image sensor (CIS) device, comprising:
a semiconductor region having a front surface and a back surface; a light-sensing region extending from the front surface towards the back surface within the semiconductor region; a first passivation layer disposed over the light-sensing region; and a gate stack formed over an area of the semiconductor region that is free of the first passivation layer, wherein the first passivation layer includes a p-type doped silicon (Si) layer, and wherein the semiconductor region includes a front adsorption layer, the first passivation layer being disposed on the front adsorption layer. |
地址 |
Hsin-Chu TW |