| 发明名称 |
SPECIMEN TESTING PACKAGE |
| 摘要 |
A specimen testing package includes a sensor chip provided in its front face with a fixing region of a reactant selectively reacting with a specimen contained in a specimen solution, a substrate to which a back face of the sensor chip is fixed, an external connection lead electrically connected to the sensor chip via a wire, an insulator provided in the substrate for insulating the wire from the outside, and a surrounding wall surrounding the fixing region in form of a continuous loop. |
| 申请公布号 |
US2016231318(A1) |
申请公布日期 |
2016.08.11 |
| 申请号 |
US201615015519 |
申请日期 |
2016.02.04 |
| 申请人 |
AISIN SEIKI KABUSHIKI KAISHA ;Mag Array, Inc. ;IMRA AMERICA, INC. |
发明人 |
TOYOMARU Koji |
| 分类号 |
G01N33/543 |
主分类号 |
G01N33/543 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A specimen testing package comprising:
a sensor chip provided in its front face with a fixing region of a reactant selectively reacting with a specimen contained in a specimen solution; a substrate to which a back face of the sensor chip is fixed; an external connection lead electrically connected to the sensor chip via a wire; an insulator provided in the substrate for insulating the wire from the outside; and a surrounding wall surrounding the fixing region in form of a continuous loop. |
| 地址 |
Kariya-shi JP |
