SYSTEM-ON-CHIP DEVICES AND METHODS OF DESIGNING A LAYOUT THEREFOR

摘要

A system-on-chip device may include a substrate with an active pattern, a gate electrode crossing the active pattern and extending in a first direction, and a first metal layer electrically connected to the active pattern and the gate electrode. The first metal layer may include a first metal line extending in the first direction and a second metal line spaced apart from the first metal line in the first direction to extend in a second direction crossing the first direction. The first and second metal lines may include first and second sidewalls parallel to the second direction, the first and second sidewalls may face each other, and the first sidewall may have a length that is two or three times a minimum line width.

主权项

1. A system-on-chip device, comprising:
a substrate with an active pattern; a gate electrode crossing the active pattern and extending in a first direction parallel to a top surface of the substrate; and a first metal layer electrically connected to the active pattern and the gate electrode, wherein: the first metal layer comprises:
a first metal line extending in the first direction; anda second metal line spaced apart from the first metal line in the first direction to extend in a second direction crossing the first direction, the first metal line comprises a first sidewall parallel to the second direction, the second metal line comprises a second sidewall parallel to the second direction, the first sidewall and the second sidewall face each other, and the first sidewall has a length that is two or three times a minimum line width.