METHOD FOR ASSEMBLING SUBSTRATES

摘要

The present invention concerns a method for assembling a first face (3) of a first substrate (1) and a first face (7) of a second substrate (5), characterised in that it comprises: forming an interlayer (11) between the first face (3) of the first substrate (1) and the first face (3) of the second substrate (5), the interlayer (11) being in contact with the first face (3) of the first substrate (1) and with the first face (7) of the second substrate (5); eliminating the interlayer (11) and bringing the first face (3) of the first substrate (1) into contact with the first face (7) of the second substrate (5).