| 摘要 |
A polishing apparatus for polishing a subject surface of a thin-plate-like object that is held by a rotary polishing head with a polishing pad that is mounted on the surface of a rotary polishing surface table. The polishing head has sucking structures such as suction grooves and a through-hole. An elastic holding film that is formed with a plurality of through-holes are attached to the object holding surface of the polishing head. The object is polished in a state that it is sucked and held by the polishing head via the holding film by vacuum suction force.
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