发明名称 STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a structure capable of keeping conductive connection even when external pressure is applied to the structure.SOLUTION: A structure 10 includes a molded material including a through hole 1, a conductive pattern 3 that is provided on the inner wall of the through hole 1 and that performs conductive connection between two faces upon which the through hole 1 opens, and an elastic body 4 that fills up the through hole 1, and the elastic body 4 is made of a material that is easily deformed against external pressure as compared with the molded material.
申请公布号 JP2014029893(A) 申请公布日期 2014.02.13
申请号 JP20120154170 申请日期 2012.07.09
申请人 SHARP CORP 发明人 OKAJIMA YUSUKE;TAKEBE HIROYUKI;KATAYAMA TOMOFUMI
分类号 H05K1/11 主分类号 H05K1/11
代理机构 代理人
主权项
地址