| 摘要 |
Provided are a packaging method and a semiconductor device. The packaging method comprises: depositing a first sacrificial layer (4) on a substrate (1), to cover a semiconductor element (3) formed on the substrate (1); covering a first dielectric layer (5) on an upper surface and a sidewall of the first sacrificial layer (4), the first dielectric layer (5) being provided with a first groove that enables a part of the first sacrificial layer (4) to be exposed; covering a second sacrificial layer (6) on the surface of the exposed first sacrificial layer (4); covering a second dielectric layer (7) on the second sacrificial layer (6) and the surface of the exposed first dielectric layer (5), the second dielectric layer (7) being provided with a release hole (8) and a second groove that enable the second sacrificial layer (6) to be exposed; depositing a fill layer (9), to fill the second groove; removing the second sacrificial layer (6) and the first sacrificial layer (4) through the release hole (8), to form a cavity; and depositing a third dielectric layer (10), to cover an exposed surface of the second dielectric layer (7) and fill the release hole (8). According to the present invention, the step of using a tube to perform packaging is avoided, packaging costs of a semiconductor element are reduced, and the yield can be improved. |
