| 摘要 |
The present invention relates to a method for forming a heat sinking pump for a circuit board. Prepared is a circular plate which comprises an insulating layer, or an insulating layer and an upper conduction layer formed on the upper surface of the insulating layer. A drilling process or a punching process is performed to form a hole which penetrates the circular plate. After that, a lower conduction layer is formed by attaching a copper plate. Electric copper plating is performed without chemical copper. So, the heat sinking bump is formed by forming a conductive material on the surface of the lower conduction layer of the hole. Productivity, reliability and thermal conductivity can be improved. |
