发明名称 |
BONDED BODY AND BONDING METHOD |
摘要 |
In a bonded body (1), a first member (2), and a second member (3) formed of a material different from that of the first member (2) are bonded to each other via a bonding layer (4) interposed therebetween. In a range of 13 μm in a cross-section of a bonding interface between the first member (2) and the bonding layer (4), the number of air bubbles having a void area of 1.5×10−3 μm2 or greater is 100 or less. |
申请公布号 |
US2016221254(A1) |
申请公布日期 |
2016.08.04 |
申请号 |
US201414908338 |
申请日期 |
2014.08.11 |
申请人 |
ASAHI KASEI CHEMICALS CORPORATION |
发明人 |
SAITO Taiga;NAGATA Kazuya |
分类号 |
B29C65/54;B32B17/06;B32B7/12;B32B15/08;B29C45/14;B29C65/00 |
主分类号 |
B29C65/54 |
代理机构 |
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代理人 |
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主权项 |
1. A bonded body, wherein
a first member, and a second member formed of a material different from that of the first member are bonded to each other via a bonding layer interposed therebetween, and in a range of 13 μm in a cross-section of a bonding interface between the first member and the bonding layer, the number of air bubbles having a void area of 1.5×10−3 μm2 or greater is 100 or less. |
地址 |
Tokyo JP |