Fan-out WLP with package

摘要

Described herein are microelectronic packages and methods of making such packages. Consistent with an example embodiment, the package includes a microelectronic unit. Conductive traces are disposed on a surface of the microelectronic unit. The package also includes a substrate with first and second opposed surfaces. The first surface faces the surface of and is in contact with the microelectronic unit; the second surface has a plurality of terminals configured for electrical connection with a least one external component. The substrate has conductive interconnects that include masses of conductive material joined to the conductive traces and electrically connected with the terminals. Conductive material passes from the second surface to the first surface and contacts the conductive traces and the terminals.

主权项

1. A microelectronic package, comprising:
a microelectronic unit; conductive traces disposed on a surface of the microelectronic unit; and a substrate having first and second opposed surfaces, the first surface facing the surface of and in contact with the microelectronic unit, the second surface having a plurality of terminals thereon configured for electrical connection with a least one external component, the substrate having conductive interconnects, the conductive interconnects including masses of conductive material joined to the conductive traces and electrically connected with the terminals, wherein the conductive material passes from the second surface to the first surface and contacting the conductive traces and the terminals.