SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and a method of making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a conductive layer that comprises an anchor portion extending through at least one dielectric layer.

主权项

1. A semiconductor device comprising:
a semiconductor die comprising a die passivation layer and a conductive pad exposed through an aperture in the die passivation layer; a first dielectric layer (DL) on the die passivation layer and comprising:
a first DL aperture through which the conductive pad is exposed; anda second DL aperture through which the die passivation layer is exposed; a conductive layer (CL) on the first dielectric layer and comprising:
a first CL portion in the first DL aperture;a second CL portion in the second DL aperture; anda third CL portion; a second dielectric layer (DL) on the conductive layer and comprising a third DL aperture through which the third CL portion is exposed; and an interconnection structure electrically connected to the third CL portion through the third DL aperture.