| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device capable of properly cutting a boundary between a device region and an outer periphery excessive region that constitute a wafer.SOLUTION: The cutting device for processing a wafer on which a recess is formed on a rear surface corresponding to a device region and an annular reinforcement part is formed on the rear surface corresponding to an outer periphery excessive region includes: a chuck table so configured as to rotatably suck and hold the wafer through a dicing tape; and cutting means including a cutting blade 74 so configured as to be rotatable including an annular cutting blade for cutting a boundary between the device region and the outer periphery excessive region. The chuck table is composed of a holding plate 41, having permeability, including an opening in a central part and a frame body 42, having permeability, having an outer diameter a little smaller than an inner diameter of the annular reinforcement part, including a detector fitted to the opening of the holding plate. Means for detecting a reference height position of the cutting blade in a state where the cutting blade is brought into contact with a top face of the detector of the chuck table is included.SELECTED DRAWING: Figure 11 |
