POLYSILOXANE COMPOSITION, CURED PRODUCT OBTAINED BY CURING THE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE CURED PRODUCT AS SEALING AGENT

摘要

PROBLEM TO BE SOLVED: To provide: a polysiloxane composition capable of suppressing formation of metal nanoparticles (fine particles) formed by a metal member constituting a semiconductor device and suppressing coloration by metal nanoparticles even when stored at high temperature and high humidity; a cured product obtained by curing the composition; and a semiconductor device using the cured product as a sealing agent.SOLUTION: There is provided a curable resin composition which comprises (A) an organic acid having at least two or more polar groups in the molecule, (B) a polysiloxane composition and (C) a hydrosilylation catalyst. There is provided a curable resin composition in which the carbon number constituting the organic acid (A) is 20 or less and one or more, preferably two or more polar groups are a carboxyl group. There is provided a curable resin composition in which the polysiloxane composition (B) is a compound having an alkenyl group and a compound having a hydrosilyl group.SELECTED DRAWING: None