发明名称 |
Light emitting device having multi-layered electrode structure |
摘要 |
A light-emitting device, comprising: a substrate; a semiconductor stacking layer comprising a first type semiconductor layer on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; and an electrode structure on the second semiconductor layer, wherein the electrode structure comprises a bonding layer, a conductive layer, and a first barrier layer between the bonding layer and the conductive layer; wherein the conductive layer has higher standard oxidation potential than that of the bonding layer. |
申请公布号 |
US9530948(B2) |
申请公布日期 |
2016.12.27 |
申请号 |
US201615049917 |
申请日期 |
2016.02.22 |
申请人 |
EPISTAR CORPORATION |
发明人 |
Kuo De-Shan;Ko Ting-Chia;Tu Chun-Hsiang;Chiu Po-Shun |
分类号 |
H01L29/18;H01L33/60;H01L33/08;H01L33/30;H01L33/32;H01L27/15 |
主分类号 |
H01L29/18 |
代理机构 |
Ditthavong & Steiner, P.C. |
代理人 |
Ditthavong & Steiner, P.C. |
主权项 |
1. A light-emitting device, comprising:
a conductive substrate; a semiconductor stacking layer comprising a first semiconductor layer on the conductive substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; a mirror layer on the semiconductor stacking layer; a first barrier layer on the mirror layer; and a bonding layer on the first barrier layer, wherein the bonding layer comprises a first metal having a thickness between 1000 Å and 42000 Å, and wherein the first barrier layer is between the mirror layer and the bonding layer, the first barrier layer comprises a plurality of first metal layers and a plurality of second metal layers alternately stacked, the material of the plurality of first metal layers is different from that of the plurality of second metal layers, and a thickness of each of the plurality of first metal layers is thicker than a thickness of each of the plurality of second metal layers. |
地址 |
Hsinchu TW |