发明名称 PACKAGING OF POWER SUPPLY USING MODULAR ELECTRONIC MODULES.
摘要 <p>An enclosure for a power supply is disclosed. The enclosure may include a control compartment configured to receive one or more control components, a transformer compartment positioned adjacent to the control compartment and configured to receive a transformer, and a power cell compartment positioned adjacent to the control compartment and the transformer compartment. The power cell compartment may be configured to receive a plurality of power cells arranged into a plurality of pods. The power cells may be received in the power cell compartment such that each power cell in a first pod is adjacent to at least two other power cells in the first pod. A voltage difference between adjacent power cells in a pod may be less than an acceptable voltage tolerance.</p>
申请公布号 MX2014000132(A) 申请公布日期 2014.02.17
申请号 MX20140000132 申请日期 2012.06.29
申请人 SIEMENS INDUSTRY, INC. 发明人 KEVIN D. WISSNER;EDWARD A. NOVACK
分类号 H02M7/00 主分类号 H02M7/00
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