| 摘要 |
A method for forming a multi-dimensional microstructure, such as but not limited to a three dimensional (3-D) microstructure coil for use in a data transducer of a data storage device. In accordance with some embodiments, the method generally includes providing a base region comprising a first conductive pathway embedded in a first dielectric material; etching a plurality of via regions in the first dielectric material that are each partially filled with a first seed layer that contacts the embedded first conductive pathway; and using the first seed layer to form a conductive pillar in each of the plurality of via regions, wherein each conductive pillar comprises a substantially vertical sidewall that extends to a first distance above the base region. |
