| 摘要 |
A semiconductor device having macro circuit including concentrated fine interconnections and extension wiring for connecting the macro circuit and the outer circuit. The widths of the fine interconnections are less than 0.1 mum. An end of the extension wiring is connected to at least two of fine interconnections of the macro circuit arranged in parallel. By this configuration, the possibility of disconnection at the portion where the end of the extension wiring and the fine interconnections are connected is suppressed.
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