发明名称 |
ELECTROPOLISHING ASSEMBLY AND METHODS FOR ELECTROPOLISHING CONDUCTIVE LAYERS |
摘要 |
In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on a wafer. An apparatus includes a wafer chuck for holding a wafer, an actuator for rotating the wafer chuck, and a nozzle configured to electropolish the wafer. The apparatus may further include a conductive ring or a shroud. A method of electropolishing a conductive film on a wafer includes rotating a wafer chuck with sufficient speed such that electrolyte fluid incident upon the wafer flows on the surface of the wafer towards the edge of the wafer. |
申请公布号 |
EP1446514(A4) |
申请公布日期 |
2007.11.28 |
申请号 |
EP20020789648 |
申请日期 |
2002.11.13 |
申请人 |
ACM RESEARCH, INC. |
发明人 |
WANG, HUI;YIH, PEIHAUR;AFNAN, MUHAMMED;NUCH, VOHA;GUTMAN, FELIX |
分类号 |
B23H3/00;C23F1/00;C25D7/12;C25F3/30;C25F7/00;H01L21/00;H01L21/288;H01L21/3205;H01L21/683;H01L21/687;(IPC1-7):C25B9/00;C25D17/00 |
主分类号 |
B23H3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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