发明名称 SUBSTRATE TREATING APPARATUS, SUBSTRATE TREATING METHOD, EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate treating apparatus capable of performing a predetermined substrate treatment even when foreign substances stick on a substrate flank. <P>SOLUTION: The suction direction of a suction portion 37a is provided as the relative movement direction of a flank PS. A suction head 37 has the suction portion 37a disposed on a front side in the movement direction so as to generate an air flow on the front side in the movement direction of the flank PS. The suction portion 37a is situated on the front side in the movement direction of the flank, i.e. in the movement direction of the foreign substances sticking on the flank PS, so the foreign substances such as liquid can be more surely sucked. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311422(A) 申请公布日期 2008.12.25
申请号 JP20070157676 申请日期 2007.06.14
申请人 NIKON CORP 发明人 KUMAZAKI KIYOAKI
分类号 H01L21/027;G03F7/20;H01L21/68 主分类号 H01L21/027
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