| 摘要 |
<p>DIE EJECTOR WITH ILLUMINATING UNIT The invention provides a die ejector (300) and a method for die alignment and ejection using said die ejector (300) during semiconductor packaging process. The die ejector (300) comprises an ejector housing (320), a needle holder (340), a plurality of ejector needles (360), and an illuminating unit (370). The illuminating unit (370), attached to the ejector housing (320), comprises a plurality of light sources (372) and a light reflective coating (374). The light emitted by the light sources (372) is directed by the light reflective coating (374) towards the lower side of a wafer (307) disposed on an adhesive film (303) above a wafer table (304). The image of the illuminated wafer (307) is captured by a vision inspection unit (480) located above the wafer (307), and is used for adjusting the position and orientation of the wafer before die ejection.</p> |
