Thermal isolation techniques

摘要

Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board with one or more heat generating components coupled thereto. The electronic assembly further includes a second circuit board with one or more heat sensitive components coupled thereto. The electronic assembly also includes a thermal barrier interconnect. The thermal barrier interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, thermal barrier interconnect is a flexible interconnect with a lower thermal conductivity than the first circuit board and the second circuit board. The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components.

主权项

1. An electronic assembly for dissipating heat, comprising:
a first rigid circuit board having a first predefined thermal conductivity, with one or more heat generating components coupled thereto; a second rigid circuit board having a second predefined thermal conductivity, with one or more heat sensitive components coupled thereto, wherein the one or more heat sensitive components are more sensitive to heat than the one or more heat generating components; and a flexible circuit board having a third predefined thermal conductivity, wherein the third predefined thermal conductivity is less than the first and second predefined thermal conductivities, the flexible circuit board electrically coupling the first rigid circuit board to the second rigid circuit board and forming, with the first and second rigid circuit boards, an airflow channel that directs airflow to dissipate heat generated by the one or more heat generating components.